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dc.contributor.authorBlonder, Gregen_US
dc.contributor.authorMazzochette, Josephen_US
dc.coverage.spatialUSen_US
dc.date.accessioned2019-07-08T19:15:12Z
dc.date.available2019-07-08T19:15:12Z
dc.date.issued2007-08-07
dc.date.submitted2004-07-19
dc.identifierhttps://patents.google.com/patent/US7252408B2/en
dc.identifier.citationGreg Blonder, Joseph Mazzochette. "LED array package with internal feedback and control." U.S. Patent 7,252,408-B2.
dc.identifier.govdocUS-7252408-B2
dc.identifier.urihttps://hdl.handle.net/2144/36270
dc.description.abstractA packaged LED array for high temperature operation comprises a metal base, the metal base including an underlying thermal connection pad. One or more layers of ceramic overly the metal base. The array includes a plurality of LED dice, each LED die having electrodes. And, the LED thermally coupled to the metal base. A driver circuit is electrically connected to the LED die electrodes and controls the LED array current. An LED driver is mounted within the LED array package, and thermally coupled to the metal base. In a second embodiment, one or more of the LED dice can be switched from the driver to a measurement circuit and used as a photodetector to measure the light output of the LED array. The measured photodetector signal can further be used as a feedback signal to control the LED array light output.en_US
dc.titleLED array package with internal feedback and controlen_US
dc.typePatenten_US
dc.description.versionPublished versionen_US
pubs.elements-sourcemanual-entryen_US
pubs.notesEmbargo: Not knownen_US
pubs.organisational-groupBoston Universityen_US
pubs.organisational-groupBoston University, College of Engineeringen_US
pubs.organisational-groupBoston University, College of Engineering, Department of Mechanical Engineeringen_US
dc.identifier.mycv421287


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