Patent collateral, investor commitment, and the market for venture lending
Hochberg, Yael V.
Serrano, Carlos J.
Ziedonis, Rosemarie H.
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Citation (published version)Yael V Hochberg, Carlos J Serrano, Rosemarie H Ziedonis. 2018. "Patent Collateral, Investor Commitment, and the Market for Venture Lending." Journal of Financial Economics, Volume 130, Issue 1, pp. 74 - 94. https://doi.org/10.1016/j.jfineco.2018.06.003
This paper investigates the market for lending to technology startups (i.e., venture lending) and examines two mechanisms that may facilitate trade within it: (1) the ‘salability’ of patent collateral; and (2) the credible commitment of existing equity investors. We find that intensified trading in the secondary patent market is strongly related to the annual rate of startup lending, particularly for startups with more redeployable patent assets. Moreover, we show that the credibility of venture capitalist commitments to reinvest in their startups’ next round of financing can be critical for startup debt provision. Utilizing the crash of 2000 as a severe and unexpected capital supply shock for VCs, we show that lenders continue to finance startups with recently funded investors better able to credibly commit to refinance their portfolio companies, but withdraw from otherwise-promising projects that may have needed their funds the most. The findings are consistent with predictions of incomplete contracting and financial intermediation theory.