Blonder, GregJohnson, Bertrand2019-07-082019-07-081990-01-301988-03-03Greg Blonder, Bertrand Johnson. "Subassembly for optoelectronic devices." U.S. Patent 4,897,711-A.US-4897711-Ahttps://hdl.handle.net/2144/36269A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber.Patent421286