Subassemblies for optoelectronic hybrid integrated circuits
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Citation (published version)Greg Blonder. "Subassemblies for optoelectronic hybrid integrated circuits." U.S. Patent 4,904,036-A.
Optoelectronic chips, such as Group III-V compound lasers and photodiodes, are mounted on a single-crystal silicon base, and are optically interconnected to one another by silica waveguides and couplers integrally formed on the base. Integrated circuit chips to provide electronic function are also mounted on the base. Various schemes for optically coupling and aligning lasers, photodiodes and optical fibers to the waveguides are described. Also described is the use of a single-crystal silicon lid, which serves to provide optical and electrical isolation between chips on the base, as well as a plug-in arrangement in which the edges of the base are adapted to receive parallel guide rods.