Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
Files
Published version
Date
2007-01-11
DOI
Authors
Mazzochette, Joseph
Amaya, Edmar
Li, Lin
Blonder, Greg
Version
Published version
OA Version
Citation
Joseph Mazzochette, Edmar Amaya, Lin Li, Greg Blonder. "Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb." Patent WO-2007005003-A1.
Abstract
A light emitting diode package assembly is provided to emulate the pattern of light produced by an incandescent filament bulb. The package assembly (100) is composed of a substrate ( 106A,B) for LEDs (102) comprising a heat-sinking base (101) having a pair of opposing major surfaces (111). Each major surface has overlying islands of electrically insulated but thermally conductive glass islands and an outer surface layer of electrically conductive reflective material (107A,B). Disposed on each outer surface layer is a plurality of LEDs. The LEDs are arranged on the surface in a configuration of low mutual obstruction. Advantageously, reflecting elements transverse to each surface layer are positioned and shaped to reflect a substantial portion of the light emitted from the LEDs that would otherwise enter neighboring LEDs. In a preferred embodiment, the LEDs are arranged in the general form of a closed curve, and a transverse reflector is disposed in the interior of the curve. Alternatively, the LEDs can be arranged in a linear array. The assembly can be efficiently fabricated by back-back assembly of two similar subassemblies.