Toward hybrid integration of exotic materials in an electronic-photonic CMOS platform via substrate removal
Files
Accepted manuscript
Date
2023
Authors
Onural, Deniz
Gevorgyan, Hayk
Eschenbaum, Carsten
Koos, Christian
Popovič, Miloš
Version
Accepted manuscript
OA Version
Citation
D. Onural, H. Gevorgyan, C. Eschenbaum, C. Koos, M. Popovič. 2023. "Toward hybrid integration of exotic materials in an electronic-photonic CMOS platform via substrate removal" CLEO 2023. https://doi.org/10.1364/cleo_si.2023.sth3h.4
Abstract
We demonstrate direct access to the silicon device layer of a monolithic CMOS electronics-photonics platform with a full-digital back-end-metal stack, in post-fabrication at die level, allowing the integration of functional materials (e.g. into slot waveguides).