Subassembly for optoelectronic devices
Files
Published version
Date
1990-07-31
DOI
Authors
Blonder, Greg
Johnson, Bertrand
Version
Published version
OA Version
Citation
Greg Blonder, Bertrand Johnson. "Subassembly for optoelectronic devices." U.S. Patent 4,945,400-A.
Abstract
A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber.