Mems device with large out-of-plane actuation and low-resistance interconnect and methods of use

Files
US20170141755A1.pdf(2.53 MB)
Published version
Date
2017-05-18
DOI
Authors
Holyoak, Michael Jarret
Kannell, George Kenneth
Beacken, Marc Jay
Bishop, David J.
Chang, Jackson
Imboden, Matthias
Version
OA Version
Citation
Michael Holyoke, George Kannel, Marc Beacken, David Bishop, Jackson Chang, Matthias Imboden. "Mems device with large out-of-plane actuation and low-resistance interconnect and methods of use." United States Patent Publication. Pub. No.: US 2017/0141755A1
Abstract
The present application is directed to a MEMS device. The MEMS device includes a substrate having a first end and a second end extending along a longitudinal axis, the Substrate including an electrostatic actuator. The device also includes a movable plate having a first end and a second end. The device also includes a thermal actuator having a first end coupled to the first end of the substrate and a second end coupled to the first end of the plate. The actuator moves the plate in relation to the substrate. Further, the device includes a power source electrically coupled to the thermal actuator and the Substrate. The application is also directed to a method for operating a MEMS device.
Description
Source: United States Patent and Trademark Office, www.uspto.gov”
License
Based on investigation of the BU Libraries' staff, this work is free of known copyright restrictions.